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    CN/EN

    產品與市場

    SF230

    特點

    ●  較低的介電損耗,插損接近LCP。

    ●  優秀的耐熱性、尺寸穩定性、耐化學性及電性能。

    ●  不含鹵素,阻燃性達到UL94 VTM-0級。

    ●  滿足RoHS指令要求,不含鉛、汞、鎘、六價鉻、多溴聯苯、多溴聯苯醚等。

    應用領域

    高速電路用撓性印制板和剛撓性印制板
    • 產品性能
    • 產品證書
    • 資料下載
    Items Method Condition Unit Typical Value
    Peel Strength (90°) IPC-TM-650 2.4.9D Accepted N/mm 1.36
    288℃, 5s 1.47
    Solder Resistance IPC-TM-650 2.4.13.F 288℃, 10s - No delamination
    Dimensional Stability IPC-TM-650 2.2.4B After Etched
    % 0.0149/-0.0360
    Chemical Resistance IPC-TM-650 2.3.2G After Chemical Exposure % >95
    Electric Strength IPC-TM-650 2.5.6.2A D-48/50+D-0.5/23 KV/mm 201
    Volume Resistivity IPC-TM-650 2.5.17E C-96/35/90 MΩ-cm 1.23×109
    Surface Resistance IPC-TM-650 2.5.17E C-96/35/90
    4.53×106
    Dielectric Constant (10GHz) SPDR C-24/23/50 - 3.2
    Dissipation Factor (10GHz) SPDR C-24/23/50
    - 0.0056
    Folding Endurance JIS C-6471 R0.8×4.9N
    Times >500
    Flammability UL94 E-24/125 Rating VTM-0

    Remarks:

    1.Certified to IPC-4204/11 Copper Clad Adhesiveless

    2.All the typical value listed above is for your reference only,please turn to Shengyi Technology Co., Ltd. for detailed information, and all rights from this data sheet are reserved by Shengyi Technology Co., Ltd.

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