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    CN/EN

    產品與市場

    ST110G

    特點

    ● 優越散熱性能

    ● 優良的耐熱性及可靠性

    ● 較低 Z-axis CTE

    應用領域

    ● PCB散熱解決方案

    ● 汽車電子

    ● DC/ DC逆變器等

    • 產品性能
    • 產品證書
    • 資料下載
    Items Method Condition Unit Typical Value
    Thermal Conductivity ASTM-D5470 A W/ (m?K) 1.0
    Tg 2.4.25D DMA 175
    Td
    2.4.24.6 Wt 5% loss 400
    Thermal Stress 2.4.13.1 288℃, solder float s 300
    T288 2.4.24.1
    TMA

    min

    60
    CTE (Z-axis) 2.4.24 Before Tg ppm/℃ 27
    After Tg ppm/℃ 176
    50-260℃ % 1.8
    Volume Resistivity 2.5.17.1 C-96/35/90 MΩ/cm 1.4x109
    Surface Resistivity
    2.5.17.1
    C-96/35/90 1.5x107
    Dielectric Breakdown 2.5.6 D-48/50+D-0.5/23 kV >45
    Peel Strength (1oz HTE) 2.4.8 288℃/10s N/mm 1.15
    Flammability
    UL94
    C-48/23/50
    Rating
    V-0
    Water Absorption IPC-TM-650 2.6.2.1
    E-1/105+D-24/23 % 0.10

    Remarks:

    1. All the typical value is based onthe 0.5mm specimen(5x106). The Value of water absorption andCTE(Z-axis) is based on the 2.0mm(15x2116).

    2. All the typical values listed above arefor your reference only and not intended for specification. Please contactShengyi Technology Co., Ltd. for detailed information. All rights from thisdata sheet are reserved by Shengyi Technology Co., Ltd.

    3. UL certificated Single/Double sidePCB min. thickness 0.38mm.

    Explanation:C=Humidity conditioning, D=Immersion conditioning in distilled water,E=Temperature conditioning

    The first digit following the letterindicates the duration of preconditioning in hours, the second digit thepreconditioning temperature in ℃ and the third digit the relativehumidity.

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