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    CN/EN

    產品與市場

    ST115G

    特點

    ● 散熱性好

    ● 優良的保溫、絕緣可靠性

    ● 較低 Z-axis CTE., 高 CTI

    ● 無鹵,Tg 175℃(DMA)

    應用領域

    ● PCB散熱解決方案

    ● 汽車電子,LED前照燈

    ● 消費類電子產品(智能終端、SSD)


    • 產品性能
    • 產品證書
    • 資料下載
    Items Method Condition Unit Typical Value
    Thermal Conductivity ASTM-D5470 A W/ (m?K) 1.6

    ASTM E1461 A
    2.0
    Tg 2.4.25D DSC 170
    Td
    2.4.24.6 Wt 5% loss 410
    Thermal Stress 2.4.13.1 288℃, solder float min
    >30
    CTE (Z-axis) 2.4.24 Before Tg ppm/℃ 37
    After Tg ppm/℃ 166
    50-260℃ % 2.2
    Volume Resistivity 2.5.17.1 C-96/35/90 MΩ/cm 108
    Surface Resistivity
    2.5.17.1
    C-96/35/90 107
    Dielectric Breakdown 2.5.6 D-48/50+D-0.5/23 kV >45
    Peel Strength (1oz) 2.4.8 288℃/10s N/mm 1.05
    Flammability
    UL94
    C-48/23/50
    Rating
    V-0
    Water Absorption IPC-TM-650 2.6.2.1
    E-1/105+D-24/23 % 0.11
    CTI IEC60112 A Rating PLC0

    Remarks:

    Remarks:

    1. All the typical value is based onthe 1.0mm specimen, while the Tg is for specimen≥0.50mm.

    2. All the typical values listed above arefor your reference only and not intended for specification. Please contactShengyi Technology Co., Ltd. for detailed information. All rights from thisdata sheet are reserved by Shengyi Technology Co., Ltd.

    3. UL certificated Single/Double sidePCB min. thickness 0.38mm.

    Explanation:C=Humidity conditioning, D=Immersion conditioning in distilled water,E=Temperature conditioning

    Thefirst digit following the letter indicates the duration of preconditioning inhours, the second digit the preconditioning temperature in ℃ and the third digit the relative humidity.

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