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    CN/EN

    產品與市場

    SH260

    特點

    ● Polyimide system

    ● Ultra-high thermal performance

    ● Tough resin system, Non-MDA chemistry

    ● Maintain mechanical strength and bonding strength at high temperature

    ● Halogen-free, chemistry and lead-free compatible

    ● RoHS/WEEE compliant

    應用領域

    Burn-in Board

    Down Hole

    Aircraft and Aerospace

    Other PCB requirements to work under high temperature for long time

    • 產品性能
    • 產品證書
    • 資料下載
    Items Method Condition Unit Typical Value
    Tg 2.4.24 TMA >250
    Td 2.4.24.6 5% wt. loss 429
    T300 2.4.24.1
    TMA min
    >60
    CTE (Z-axis) 2.4.24 50-260℃ (X/Y) ppm/℃ 12-15
    α1 (before Tg) ppm/℃ 45
    50-260℃ % 1.20
    Dissipation Constant (1GHz) 2.5.5.9 C-24/23/50 - 4.12
    Dissipation Factor (1GHz)
    2.5.5.9
    C-24/23/50
    - 0.007
    Volume Resistivity 2.5.17.1 C-96/35/90 MΩ.cm 7.45 x 107
    Surface Resistivity
    2.5.17.1
    C-96/35/90 4.79 x 107
    Arc Resistance 2.5.1 D-48/50+D-0.5/23 s 180
    Dielectric Breakdown 2.5.6 D-48/50+D-0.5/23 kV 40.5
    Peel Strength (1Oz) 2.4.8 288℃/10s N/mm[lb/in] 1.37[7.83]
    Flexural Strength 2.4.4 50℃/260 MPa

    530/439

    Water Absorption 2.6.2.1 E-1/105+D-24/23 % 0.26
    Flammability
    UL94
    C-48/23/50
    Rating
    HB

    Remarks:

    1. Specimen thickness: 1.6mm. Test method is according to IPC-TM-650.

    2. All the typical values listed above are for your reference only and not intended for specification. Please contact Shengyi Technology Co., Ltd. for detailed information. All rights from this data sheet are reserved by Shengyi Technology Co., Ltd.

    Explanation: C=Humidity conditioning, D=Immersion conditioning in distilled water, E=Temperature conditioning.

    The first digit following the letter indicates the duration of preconditioning in hours, the second digit the preconditioning temperature in and the third digit the relative humidity.

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