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    CN/EN

    產品與市場

    SI13U

    特點

    Tg≥230℃ (DMA),Td>400℃ (5% loss, TGA)
    High Flexural Modulus/Low X, Y / Z-axis CTE
    Good punching & Drilling ability
    Halogen-free compatible with lead-free processing. RoHS/WEEE compliant.


    應用領域

    Memory Card, SSD,DRAM

    Fingerprint, RFModule, AP

    BOC, COB, WBBGA

    • 產品性能
    • 產品證書
    • 資料下載
    Items Condition Unit SI13U
    Tg DMA 245
    Td 5% wt. loss
    >400
    CTE (X/Y-axis) Before Tg ppm/℃
    13
    CTE (Z-axis)
    α1/α2 ppm/℃
    30/140
    Dielectric Constant * (1GHz) @1GHz - 4.8
    Dissipation Factor * (1GHz)
    @1GHz - 0.013
    Peel Strength * 1/3 OZ, LP Cu N/mm
    0.90
    Solder Dipping @288℃ min >30
    Young's modulus 50℃ GPa 22
    Young's modulus
    200℃ GPa
    13
    Flexural Modulus* 50℃
    GPa
    28
    Flexural Modulus*
    200℃
    GPa
    15
    Water Absorption*
    A % 0.14
    Water Absorption* 85℃/85%RH, 168Hr %
    0.35
    Flammability
    UL-94 Rating
    V-0
    Thermal Conductivity - W/(m.K) 0.58
    Color - - Black

    Remarks:

    Specimen thickness: 0.10mm, besides the items with * is for 0.8mm specimen thickness. Test method is according to IPC-TM-650.

    All the typical value listed above is foryour reference only, please turn to Shengyi Technology Co., Ltd. for detailed information, and all rights from this data sheet are reserved by Shengyi Technology Co., Ltd.

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