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    CN/EN

    產品與市場

    SI10US

    特點

    ● 低CTE,高模量,可有效降低封裝基板的翹曲
    優異的耐濕熱性
    良好的PCB加工性
    無鹵材料

    應用領域

    • eMMC, DRAM
    • AP, PA
    • Dual CM
    • Fingerprint, RF Module


    • 產品性能
    • 產品證書
    • 資料下載
    Items Condition Unit SI10US
    Tg DMA 280
    Td 5% wt. loss
    >400
    CTE (X/Y-axis) Before Tg ppm/℃
    10
    CTE (Z-axis)
    α1/α2 ppm/℃
    25/135
    Dielectric Constant 1) (1GHz) 2.5.5.9 - 4.4
    Dissipation Factor 1) (1GHz)
    2.5.5.9 - 0.007
    Peel Strength1) 1/3 OZ, VLP Cu N/mm
    0.80
    Solder Dipping @288℃ min >30
    Young's modulus 50℃ GPa 26
    Young's modulus
    200 GPa
    23
    Flexural Modulus1) 50℃
    GPa
    32
    Flexural Modulus1)
    200
    GPa
    27
    Water Absorption1)
    A % 0.14
    Water Absorption1) 85℃/85%RH,168Hr %
    0.35
    Flammability
    UL-94 Rating
    V-0
    Thermal Conductivity - W/(m.K) 0.61
    Color - - Black

    Remarks:

    *Specimen thickness: 0.10mm. Test method is according to IPC-TM-650.

    *1): specimen thickness: 0.80mm.

    All the typical value listed above isfor your reference only, please turn to Shengyi Technology Co.,Ltd. fordetailed information, and all rights from this data sheet are reserved byShengyi Technology Co.,Ltd.


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